1. Li Y, Liu Y. Design and Simulation of System in Package (in Chinese). Beijing: Electronics Industry Press, 2012 [李扬, 刘杨. SiP系统级封装设计与仿真. 北京: 电子工业出版社, 2012].
2. Zhang D Z, Hua G X, Liu H J, et al. Requirement analysis of SoC technology in space applications (in Chinese). Aerospace Standard, 2011, 1: 25–30 [张笃周, 华更新, 刘鸿瑾, 等. SoC技术在空间应用中的需求分析. 航天标准化, 2011, 1: 25–30].
3. Wang H. Application of SiP technology in aerospace products (in Chinese). Aerospace Standard, 2013, 1: 30–33 [王豪. SiP技术在宇航产品中的应用. 航天标准化, 2013, 1: 30–33].
4. Jin B-L, Chen J-P. Radar countermeasure equipment integration development in the age of back-Moore (in Chinese). Shipboard Elec Counter, 2015, 38: 4 [金宝龙, 陈建平. 后摩尔时代雷达对抗装备集成化发展. 舰船电子对抗, 2015, 38: 4].
5. Guo F-Z, Xu R-M. Research of key technology in system in package (in Chinese). J Microw, 2014, 588–593 [过方舟, 徐锐敏. 系统级封装关键技术研究进展. 微波学报, 2014, 588–593].