Reducing drag penalty in the three-dimensional supersonic biplane

Author:

Yonezawa M1,Obayashi S1

Affiliation:

1. Institute of Fluid Science, Tohoku University, Katahira, Aoba-ku, Sendai, Japan

Abstract

The two-dimensional (2D) supersonic biplane is well known for its shock wave cancellation effect and zero wave drag at supersonic speed. Nonetheless, in a three-dimensional (3D) setting, this favourable shock wave interaction becomes disturbed in the Mach cone regions at the wing tips of the supersonic biplane, which results in a severe drag penalty near the wing tips. However, this can be alleviated by appropriately designing the planform of the biplane. This study was performed to investigate the patterns of the 3D shock wave interaction using computational fluid dynamics by considering the 3D supersonic biplane with different planforms. The drag was shown to become large when the wing has a high sweepback angle, and it became small when the wing has a small taper ratio. However, an excessively low taper ratio could also lead to a drag greater than that of the rectangular supersonic biplane. It was found that the low drag 3D supersonic biplane has a small sweepback angle and an adequate taper ratio, which results in the vertex line becoming almost perpendicular to the freestream. Thus, in the design of the low drag 3D supersonic biplane, it is important to take into consideration the trade-off between the drag reduction at the mid-span section and the drag penalty near the wing tip and the wing root.

Publisher

SAGE Publications

Subject

Mechanical Engineering,Aerospace Engineering

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3