1. Burghardt M., Liemann G., Klink G., Bock K. Evaluation of reel-to-reel processes for polymer electronics. Proceedings of 3rd International IEEE Conference on Polymers and adhesives in microelectronics and photonics, ‘polytronic 2003’, 21-23 October 2003, Montreux, Switzerland, pp. 287–293.
2. Kololuoma T., Tuomikoski M., Mäkelä M., Heilmann J., Haring T., Kallioinen J., Hagberg J., Kettunen I., Kopola H. Proceedings of SPIE 5363, Emerging Optoelectronic Applications2004, pp. 77–85.
3. Organic light emitting devices with enhanced outcoupling via microlenses fabricated by imprint lithography
4. Schuenemann M., Packaging of disposable chips for bioanalytical application. Electronic Components and Technology Conference2004, pp. 853–861.
5. Review on micro molding of thermoplastic polymers