Control of Additives in Copper Electrorefining by Using the Hull Cell Test.-Reference-Cited by-同舟云学术

Control of Additives in Copper Electrorefining by Using the Hull Cell Test.

Published:2002 Issue:2 Volume:118 Page:86-90
ISSN:0916-1740
Container-title:Shigen-to-Sozai
language:
Short-container-title:Shigen-to-Sozai

Author:

ANDO Koji,TSUCHIDA Naoyuki,KOMI Hiroshi

Publisher

Mining and Materials Processing Institute of Japan

Reference5 articles.

1. 1)Belcha, V.K., Wang, Z.Z. and Krueger, D.W. : Glue Analysis and Behavior in Copper Electrolyte, Metallurgical Transaction, Vol.24B, p. 277-287, (1993)

2. 2)杉本誠人・安藤孝治・塚越幸夫・岡本信幸 : 資源・素材学会,平成5年度春季大会講演要旨集,p. 91-92, (1993)

3. The effect of antimony, chloride ion, and glue on copper electrorefining

4. 4)三根剛四郎・富永睦男・清山哲郎 : 硫酸銅メッキ浴からの銅電着におけるチオ尿素(C¹⁴,S³⁵)の共析,電気化学,Vol. 35, p. 472-477, (1964)

5. 5)Savan, M.D., Scott, J.D. and Cassidy, R.M. : Collagen Proteins in Electrorefining Rate Constant for Glue Hydrolysys and Effect of Molar Mass on Glue Activity, Metallurgical Transaction, Vol.23B, April, p. 125-133, (1992)

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