Synergistic Effect of Polymer Additives and Chloride Ions on Copper Electrorefining-Reference-Cited by-同舟云学术

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Synergistic Effect of Polymer Additives and Chloride Ions on Copper Electrorefining

Published:2007 Issue:4/5 Volume:123 Page:165-170
ISSN:1881-6118
Container-title:Journal of MMIJ
language:
Short-container-title:Journal of the Mining and Materials Processing Institute of Japan

Author:

NAKANO Hiroaki,OUE Satoshi,AOYA Kengo,KUBOYAMA Hiroshi,FUKUSHIMA Hisaaki,KOBAYASHI Shigeo

Publisher

Mining and Materials Processing Institute of Japan

Reference11 articles.

1. 1) C.L. Mantell, Electrochemical Engineering, (McGraw-Hill Book Company, Inc., New York, NY, U.S.A., 1960), pp.142-167, 185-192, 210-224.

2. 2) Hitetsu Kinzoku Seiren, (Nippon Kinzoku Gakkai, Sendai, 1980), pp.228,241.

3. 3) Denki Kagaku Binran, (Denki kagaku Kyoukai, Maruzen, Tokyo, 1985), pp.308-327.

4. 4) H. Nakano, S. Oue, T. Ohgai, K. Izumi, T. Akiyama and H. Fukushima: Journal of MMIJ, 119(2003), 663-667.

5. 5) H. Nakano, S. Oue, Y. Ozaki, T. Akiyama and H. Fukushima: Journal of MMIJ, 119(2003), 569-572.

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Halide Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder;MATERIALS TRANSACTIONS;2021-11-01

2. Effect of Polymer Additives and Chloride Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder;Journal of the Japan Institute of Metals and Materials;2021-07-01

3. Effect of Halide Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder;Journal of the Japan Institute of Metals and Materials;2021-06-01

4. Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution;MATERIALS TRANSACTIONS;2020-05-01

5. Electrorefining of copper and anode passivation;Journal of MMIJ;2020-03-31

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