Abstract
With significant reduction in the size of ICs, there has been a massive increase in the operating speed. Due to this condition, the area available for interconnects within the transistor and between transistors in an IC is greatly reduced. Carbon wires pose high resistance and power dissipation in constrained space. It is necessary to opt efficient means to overcome this issue. The drawbacks of traditional metallic interconnects are overcome by nanocarbon interconnects. Considering factors such as shrinking dimensions, interconnect delay and power dissipation, we have considered four nanocarbon interconnect structures for analysis in this paper. The design and efficiency are analysed for Graphene Nanoribbon (GNR), Carbon Nanotube, Cu-Nanocarbon and All Carbon 3-D interconnects.
Publisher
Inventive Research Organization
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