Data Convection-Reference-Cited by-同舟云学术

Data Convection

Published:2022-06-06 Issue: Volume: Page:
ISSN:
Container-title:Abstract Proceedings of the 2022 ACM SIGMETRICS/IFIP PERFORMANCE Joint International Conference on Measurement and Modeling of Computer Systems
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Author:

Khadirsharbiyani Soheil¹,Kotra Jagadish²,Rao Karthik³,Kandemir Mahmut Taylan¹

Affiliation:

1. Pennsylvania State University, University Park, PA, USA

2. AMD Research, Austin, TX, USA

3. Advanced Micro Devices Inc., Austin, TX, USA

Funder

NSF (National Science Foundation)

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3489048.3522647

Reference7 articles.

1. HBM. 2015. High-Bandwidth Memory (HBM) reinventing memory technology. https://www.amd.com/system/files/documents/high-bandwidth-memory-hbm.pdf HBM. 2015. High-Bandwidth Memory (HBM) reinventing memory technology. https://www.amd.com/system/files/documents/high-bandwidth-memory-hbm.pdf

2. HMC. 2018. Hybrid Memory Cube Consortium. https://www.micron.com/-/media/client/global/documents/products/data-sheet/hmc/gen2/hmc_gen2.pdf HMC. 2018. Hybrid Memory Cube Consortium. https://www.micron.com/-/media/client/global/documents/products/data-sheet/hmc/gen2/hmc_gen2.pdf

3. JEDEC. 2014. JEDEC publishes Wide I/O 2 mobile DRAM standard. https://www.jedec.org/news/pressreleases/jedec-publishes-wide-io-2-mobile-dram-standard JEDEC. 2014. JEDEC publishes Wide I/O 2 mobile DRAM standard. https://www.jedec.org/news/pressreleases/jedec-publishes-wide-io-2-mobile-dram-standard

4. X. Jiang , N. Madan , L. Zhao , M. Upton , R. Iyer , S. Makineni , D. Newell , Y. Solihin , and R. Balasubramonian . 2010. CHOP: adaptive filter-based DRAM caching for CMP server platforms . In In proceedings of The Sixteenth International Symposium on High-Performance Computer Architecture (HPCA). 1--12 . X. Jiang, N. Madan, L. Zhao, M. Upton, R. Iyer, S. Makineni, D. Newell, Y. Solihin, and R. Balasubramonian. 2010. CHOP: adaptive filter-based DRAM caching for CMP server platforms. In In proceedings of The Sixteenth International Symposium on High-Performance Computer Architecture (HPCA). 1--12.

5. Makoto Motoyoshi . 2009. Through-silicon via (TSV). Proc . IEEE ( 2009 ). Makoto Motoyoshi. 2009. Through-silicon via (TSV). Proc. IEEE (2009).

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