LiquID

Author:

Dhekne Ashutosh1,Gowda Mahanth2,Zhao Yixuan1,Hassanieh Haitham1,Choudhury Romit Roy1

Affiliation:

1. University of Illinois at Urbana-Champaign

2. Penn State University

Funder

NSF

Publisher

ACM

Reference42 articles.

1. 6 techniques for measuring dielectric properties. https://www.degruyter.com/downloadpdf/books/9783110455403/9783110455403-007/9783110455403-007.pdf. 6 techniques for measuring dielectric properties. https://www.degruyter.com/downloadpdf/books/9783110455403/9783110455403-007/9783110455403-007.pdf.

2. AccuraUWB Flex Series. http://cdn.taoglas.com/datasheets/FXUWB20.01.0100C.pdf. AccuraUWB Flex Series. http://cdn.taoglas.com/datasheets/FXUWB20.01.0100C.pdf.

3. DW1000-I-TR13 individual uwb chip pricing. https://www.digikey.com/short/j47cd1. DW1000-I-TR13 individual uwb chip pricing. https://www.digikey.com/short/j47cd1.

4. DW1000 IEEE802.15.4-2011 UWB Transceiver Datasheet. https://www.decawave.com/products/dw1000. DW1000 IEEE802.15.4-2011 UWB Transceiver Datasheet. https://www.decawave.com/products/dw1000.

5. HP85070A Dielectric Probe Kit. https://literature.cdn.keysight.com/litweb/pdf/85070-90001.pdf?id = 1326230. HP85070A Dielectric Probe Kit. https://literature.cdn.keysight.com/litweb/pdf/85070-90001.pdf?id = 1326230.

Cited by 76 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Wi-Painter;Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies;2023-12-19

2. FSS-Tag;Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies;2023-12-19

3. LiqDetector;Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies;2023-12-19

4. Research on Improving Bp Network for Residual Liquid Detection Technology;2023 20th International Computer Conference on Wavelet Active Media Technology and Information Processing (ICCWAMTIP);2023-12-15

5. RadarFoot: Fine-grain Ground Surface Context Awareness for Smart Shoes;Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology;2023-10-29

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