Simulation and Testing Analysis Involving Different Fan Parameters

Author:

Zong Bin1ORCID,Zhou Lizhi1ORCID,Lv Zhibo1ORCID,Gong Baolong1ORCID,Jia Long1ORCID

Affiliation:

1. State Key Laboratory of High-end Server & Storage Technology, Inspur Electronics information Industry Co., LTD, China

Publisher

ACM

Reference10 articles.

1. Investigation of a computer CPU heat sink under laminar forced convection using a structural stability method [J];Moradikazerouni Alireza;International Journal of Heat and Mass Transfer.,2019

2. Experimental investigation of the heat transfer performance of microchannel heat exchangers with fan-shaped cavities

3. Effect of channel angle of pin-fin heat sink on heat transfer performance using water based graphene nanoplatelets nanofluids

4. Ho, J. Y., Leong, K. C. Cylindrical porous inserts for enhancing the thermal and hydraulic performance of water-cooled cold plates [J]. Applied thermal engineering: Design, processes, equipment, economics. 2017. 121863-878.

5. Ghasemi, Seyed Ebrahim, Ranjbar, A. A., Hosseini, M. J.. Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application [J]. Microelectronics & reliability. 2017, 73(Jun.).

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3