Database Construction and SPC Technology for Solder Paste Defect Inspection
Author:
Affiliation:
1. School of Electronics and Information, Northwestern Polytechnical University, Changan District, Xi'an, Shaanxi, China
2. Unmanned system research institute, Northwestern Polytechnical University, Youyi District, Xi'an, Shaanxi, China
Funder
Department of Science and Technology of Shaanxi Province, China
Publisher
ACM Press
Reference8 articles.
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3. Sakai H, Suzuki M, Igarashi M, et al. Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed: US, US 20020179695 A1 [P]. 2002.
4. Caulcutt R. Statistical Process Control (SPC) [M]. Produktions management. Gabler, 1996.
5. Kashel J, Bullerwell M, Kent T. Microsoft SQL Server 2008 R2 Master Data Services [M]. Packt Publishing, 2011.
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