A Survey on Chip to System Reverse Engineering

Author:

Quadir Shahed E.1,Chen Junlin1,Forte Domenic2,Asadizanjani Navid2,Shahbazmohamadi Sina3,Wang Lei1,Chandy John1,Tehranipoor Mark2

Affiliation:

1. University of Connecticut, CT, USA

2. University of Connecticut, FL, USA

3. University of Connecticut, NY, USA

Abstract

The reverse engineering (RE) of electronic chips and systems can be used with honest and dishonest intentions. To inhibit RE for those with dishonest intentions (e.g., piracy and counterfeiting), it is important that the community is aware of the state-of-the-art capabilities available to attackers today. In this article, we will be presenting a survey of RE and anti-RE techniques on the chip, board, and system levels. We also highlight the current challenges and limitations of anti-RE and the research needed to overcome them. This survey should be of interest to both governmental and industrial bodies whose critical systems and intellectual property (IP) require protection from foreign enemies and counterfeiters who possess advanced RE capabilities.

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

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