Thermal-aware optical-electrical routing codesign for on-chip signal communications-Reference-Cited by-同舟云学术

Thermal-aware optical-electrical routing codesign for on-chip signal communications

Published:2022-07-10 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 59th ACM/IEEE Design Automation Conference
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Author:

Lu Yu-Sheng¹,Chen Kuan-Cheng¹,Hsu Yu-Ling¹,Chang Yao-Wen¹

Affiliation:

1. National Taiwan University, Taipei, Taiwan

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3489517.3530404

Reference24 articles.

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5. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

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