MorphingCircuit

Abstract

Manufacturing nonplanar electronics often requires the integration of functions and forms through embedding circuit boards into three-dimensional (3D) shapes. While most popular solutions rely on cavities where electronics reside in forms of rigid circuit boards, other alternative approaches leverage 3D printing or layer lamination to create 3D electronics that often require expensive manufacturing processes and materials. Furthermore, many conventional methods are incompatible with complex geometries (e.g., surfaces that twist or have local minima). In response, we introduce MorphingCircuit, an integrated design, simulation, and fabrication workflow that combines electronic functions with forms through four-dimensional (4D) printing, which effectively reduces cost, production time, and e-waste. Specifically, we start by printing a flat substrate and assembling functional electronics on top of it. The flat structure will then self-morph into a preprogrammed 3D shape when triggered by external heating. Overall, our comprehensive 3D electronics fabrication pipeline encompasses the design, simulation, fabrication, and transformation, with which we hope to inspire designers, researchers, and makers to create conformal electronics on complex substrate geometries that were previously difficult or impossible to design or manufacture.