Architectural opportunities for novel dynamic EMI shifting (DEMIS)

Author:

Gorman Daphne I.1,Guthaus Matthew R.1,Renau Jose1

Affiliation:

1. University of California Santa Cruz

Funder

National Science Foundation

Publisher

ACM

Reference33 articles.

1. 3GPP. {n. d.}. 3GPP TS 36.211: E-UTRA:Physical Channels and Modulation. ({n. d.}). www.3gpp.org/dynareport/36211.htm. 3GPP. {n. d.}. 3GPP TS 36.211: E-UTRA:Physical Channels and Modulation. ({n. d.}). www.3gpp.org/dynareport/36211.htm.

2. HFSS Ansoft. 2007. ver. 11. Ansoft Corporation Pittsburgh PA (2007). HFSS Ansoft. 2007. ver. 11. Ansoft Corporation Pittsburgh PA (2007).

3. A brief history of just-in-time

4. In-system diagnosis of RF ICs for tolerance against on-chip in-band interferers

5. Bonnie Baker. 2012. EMI Problems? Part two: Where does EMI come from? (2012). http://www.edn.com/electronics-blogs/bakers-best/4369076/EMI-problems-Part-two-Where-does-EMI-come-from-. Bonnie Baker. 2012. EMI Problems? Part two: Where does EMI come from? (2012). http://www.edn.com/electronics-blogs/bakers-best/4369076/EMI-problems-Part-two-Where-does-EMI-come-from-.

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Harnessing CPU Electromagnetic Emanations for Resonance-Induced Voltage-Noise Characterization;IEEE Transactions on Computers;2021-09-01

2. EMSim: A Microarchitecture-Level Simulation Tool for Modeling Electromagnetic Side-Channel Signals;2020 IEEE International Symposium on High Performance Computer Architecture (HPCA);2020-02

3. EMI Architectural Model and Core Hopping;Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture;2019-10-12

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