Physics-based full-chip TDDB assessment for BEOL interconnects
Author:
Affiliation:
1. University of California, Riverside, CA
2. Mentor Graphics Corporation, Fremont, CA
Funder
Semiconductor Research Corporation
National Science Foundation
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2897937.2898062
Reference16 articles.
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2. Time Dependent Dielectric Breakdown Physics ãĂŞ Models Revisited;McPherson J. W.;Microelectronics Reliability,2012
3. Underlying Physics of the Thermochemical E Model in Describing Low-Field Time-Dependent Dielectric Breakdown in SiO2 Thin Films;McPherson J.;Journal of Applied Physics,1998
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