An analytical model for on-chip interconnects in multimedia embedded systems
Author:
Affiliation:
1. Chinese Academy of Sciences
2. University of Bradford
3. University of Texas at San Antonio
4. St. Francis Xavier University
Abstract
Funder
Ministry of Science and Technology of the People's Republic of China
National Natural Science Foundation of China
Chinese Academy of Sciences
Publisher
Association for Computing Machinery (ACM)
Subject
Hardware and Architecture,Software
Link
https://dl.acm.org/doi/pdf/10.1145/2536747.2536751
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