Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors
Author:
Affiliation:
1. University of Electronic Science and Technology of China, Chengdu, China
2. University of California at Riverside, Riverside, California
3. Southwest China Research Institute of Electronic Equipment, Chengdu, China
Abstract
Funder
Semiconductor Research Corporation
Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices
National Science Foundation
Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry
National Natural Science Foundation of China
Publisher
Association for Computing Machinery (ACM)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Link
https://dl.acm.org/doi/pdf/10.1145/2891409
Reference32 articles.
1. Predict and act
2. Thermal and Energy Management of High-Performance Multicores: Distributed and Self-Calibrating Model-Predictive Controller
3. Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors
4. Wattch
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