Single-Layer Obstacle-Aware Substrate Routing via Iterative Pin Reassignment and Wire Assignment

Author:

Yan Jin-Tai1

Affiliation:

1. Tainan National University of the Arts, Tainan, Taiwan

Abstract

It is known that single-layer obstacle-aware substrate routing is necessary for modern IC/Package designs. In this article, given a set of two-pin nets and a set of rectangular obstacles inside a single-layer routing plane, a two-phase routing algorithm including an iterative routing phase and a rip-up-and-reroute phase can be proposed to maximize the number of the routed nets in single-layer obstacle-aware substrate routing. In the iterative routing phase, based on the pin and path distribution of the routing nets and the locations of the obstacles inside a single-layer routing plane, the start or target pins on some routing nets inside dense obstacle regions may be firstly reassigned to complete the partial wiring paths on the nets. Based on the region extraction of two intersected nets in single-layer routing, the private regions of some routing nets inside sparse obstacle regions can be extracted and the nets inside the extracted regions can be further routed by using maze routing. In the rip-up-and-reroute phase, the routability of the routing nets can be improved by ripping up some routed nets and rerouting the unrouted nets. Compared with Liu's modified algorithm and Yan's flow-based algorithm in single-layer obstacle-aware substrate routing, the experimental results show that the proposed algorithm can use less CPU time to increase 3.4% and 1.8% of the routability on the routing nets for eight tested examples on the average. Additionally, the percentage of the tested examples with the 100% routability of the routing nets on the eight tested examples has been improved from 25% to 62.5%.

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Reference16 articles.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

2. Via-Avoidance-Oriented Interposer Routing for Layer Minimization in 2.5-D IC Designs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2021-11

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