Thermal/performance characterization of CMPs with 3D-stacked DRAMs under synergistic voltage-frequency control of cores and DRAMs-Reference-Cited by-同舟云学术

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Thermal/performance characterization of CMPs with 3D-stacked DRAMs under synergistic voltage-frequency control of cores and DRAMs

Published:2015-10-09 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2015 Conference on research in adaptive and convergent systems
language:
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Author:

Chen Yi-Jung¹,Yang Chia-Lin²,Lin Ping-Sheng²,Lu Yi-Chang²

Affiliation:

1. National Chi Nan University

2. National Taiwan University

Funder

Macronix International Co., Ltd.

Ministry of Science and Technology, Taiwan

Excellent Research Projects of National Taiwan University

Etron Technology Inc.

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/2811411.2811515

Reference22 articles.

1. Energy efficient proactive thermal management in memory subsystem

2. CoScale: Coordinating CPU and Memory System DVFS in Server Systems

3. MultiScale

4. MemScale

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation;ACM Transactions on Embedded Computing Systems;2023-09-09

2. Data Convection;Proceedings of the ACM on Measurement and Analysis of Computing Systems;2022-02-24

3. Thermal-aware memory system synthesis for MPSoCs with 3D-stacked hybrid memories;Proceedings of the 35th Annual ACM Symposium on Applied Computing;2020-03-29

4. Joint frequency scaling of processor and DRAM;The Journal of Supercomputing;2016-03-02

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