Computational Support for Multiplicity in Hierarchical Electronics Design-Reference-Cited by-同舟云学术

Computational Support for Multiplicity in Hierarchical Electronics Design

Published:2022-10-26 Issue: Volume: Page:
ISSN:
Container-title:Symposium on Computational Fabrication
language:
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Author:

Lin Richard¹,Ramesh Rohit²,Dutta Prabal²,Hartmann Bjoern²,Mehta Ankur¹

Affiliation:

1. University of California, Los Angeles, USA

2. University of California, Berkeley, USA

Funder

Defense Advanced Research Projects Agency

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3559400.3561997

Reference27 articles.

1. Altium. 2018. Altium Designer. https://www.altium.com/altium-designer/ Altium. 2018. Altium Designer. https://www.altium.com/altium-designer/

2. Autodesk. 2018. EAGLE | PCB Design Software. https://www.autodesk.com/products/eagle/overview Autodesk. 2018. EAGLE | PCB Design Software. https://www.autodesk.com/products/eagle/overview

3. JITPCB

4. Nicola Bezzo Peter Gebhard Insup Lee Matthew Piccoli Vijay Kumar and Mark Yim. 2015. Rapid Co-Design of Electro-Mechanical Specifications for Robotic Systems(International Design Engineering Technical Conferences and Computers and Information in Engineering Conference Vol. Volume 9: 2015 ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications). https://doi.org/10.1115/DETC2015-47472 arXiv:https://asmedigitalcollection.asme.org/IDETC-CIE/proceedings-pdf/IDETC-CIE2015/57199/V009T07A009/4225178/v009t07a009-detc2015-47472.pdfV009T07A009. 10.1115/DETC2015-47472

5. Nicola Bezzo Peter Gebhard Insup Lee Matthew Piccoli Vijay Kumar and Mark Yim. 2015. Rapid Co-Design of Electro-Mechanical Specifications for Robotic Systems(International Design Engineering Technical Conferences and Computers and Information in Engineering Conference Vol. Volume 9: 2015 ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications). https://doi.org/10.1115/DETC2015-47472 arXiv:https://asmedigitalcollection.asme.org/IDETC-CIE/proceedings-pdf/IDETC-CIE2015/57199/V009T07A009/4225178/v009t07a009-detc2015-47472.pdfV009T07A009.

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