Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects-Reference-Cited by-同舟云学术

Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects

Published:2023-01-16 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 28th Asia and South Pacific Design Automation Conference
language:
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Author:

Nagao Takuma¹,Nakamura Tomoki²,Kajiyama Masuo²,Eiki Makoto²,Inoue Michiko¹,Shintani Michihiro³

Affiliation:

1. Nara Institute of Science and Technology, Ikoma, Japan

2. Sony Semiconductor Manufacturing Corporation, Isahaya, Japan

3. Kyoto Institute of Technology, Kyoto, Japan

Funder

JSPS KAKENHI Grant

Publisher

ACM

Link

Reference21 articles.

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3. Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects;IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences;2023