Mixed-Type Wafer Failure Pattern Recognition
Author:
Affiliation:
1. ShanghaiTech University
2. The Chinese University of Hong Kong
3. University of Science and Technology of China
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3566097.3568363
Reference56 articles.
1. The binomial test: a simple tool to identify process problems;Kaempf U.;IEEE TSM,1995
2. Inspection and Classification of Semiconductor Wafer Surface Defects Using CNN Deep Learning Networks
3. Wafer map failure pattern recognition and similarity ranking for large-scale data sets;Wu M.-J.;IEEE TSM,2015
4. Deformable convolutional networks for efficient mixed-type wafer defect pattern recognition;Wang J.;IEEE TSM,2020
5. Fuzzy neural network-based rescheduling decision mechanism for semiconductor manufacturing
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1. PaLM: Point Cloud and Large Pre-trained Model Catch Mixed-type Wafer Defect Pattern Recognition;2024 Design, Automation & Test in Europe Conference & Exhibition (DATE);2024-03-25
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