Thermal Characterization of AI Applications on AI Accelerators-equipped Microcontrollers-Reference-Cited by-同舟云学术

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Thermal Characterization of AI Applications on AI Accelerators-equipped Microcontrollers

Published:2024-06-03 Issue: Volume: Page:17-22
ISSN:
Container-title:Proceedings of the Workshop on Body-Centric Computing Systems
language:
Short-container-title:

Author:

Jang SiYoung¹^ORCID,Kawsar Fahim²^ORCID,Min Chulhong¹^ORCID

Affiliation:

1. Nokia Bell Labs, Cambridge, UK

2. Nokia Bell Labs and University of Glasgow, Cambridge and Glasgow, UK

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3662009.3662020

Reference13 articles.

1. Amirhossein Ahmadi, Hazem A Abdelhafez, Karthik Pattabiraman. and Matei Ripeanu. 2023. EdgeEngine: A Thermal-Aware Optimization Framework for Edge Inference. In 2023 IEEE/ACM Symposium on Edge Computing (SEC). IEEE, 67--79.

2. On the Efficiency of Voltage Overscaling under Temperature and Aging Effects

3. Children Wearable may cause skin burns [n. d.]. Wearable Children's Thermometer May Cause Skin Burns. https://www.mddionline.com/regulatory-quality/wearable-children-s-thermometer-may-cause-skin-burns. Accessed: 30 Mar. 2024.

4. Rudolf Clausius. 1879. The mechanical theory of heat. Macmillan.

5. Coral Micro [n. d.]. Google LCC. https://coral.ai/products/dev-board-micro/. Accessed: 30 Mar. 2024.

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