1. T. Linz, M. von Krshiwoblozki, H. Walter, and P. Foerster, "Contacting electronics to fabric circuits with nonconductive adhesive bonding,"J. Text. Inst., v.103, no10, pp. 1139--50, 2012.
2. D. I. Lehn, C. W. Neely, K. Schoonover, T. L. Martin, and M. T. Jones, "e-TAGs: e-Textile Attached Gadgets," inin Proc. of Communication Networks and Distributed Systems: Modeling and Simulation, 2004.
3. L. E. Dunne and C. Simon, "E-Textiles in the Apparel Factory: Leveraging Cut-And-Sew Technology Toward the Next Generation of Smart Garments," inFundamentals of Wearable Computers and Augmented Reality, 2nd ed., Boca Raton, FL: CRC Press, 2015.
4. L. E. Dunne, K. Bibeau, L. Mulligan, A. Frith, and C. Simon, "Multi-Layer E-Textile Circuits," inProc. of the ACM Intl. Conference on Ubiquitous Computing, Pittsburgh, PA, 2012.
5. G. F. Eichinger, K. Baumann, T. Martin, and M. Jones, "Using a PCB Layout Tool to Create Embroidered Circuits," inProc. of the 11th IEEE Intl. Symposium on Wearable Computers, 2007.