Learning-based prediction of package power delivery network quality
Author:
Affiliation:
1. Qualcomm Technologies, Inc.
2. UC San Diego
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3287624.3287689
Reference20 articles.
1. Three-Dimensional Inductance Computations with Partial Element Equivalent Circuits
2. Multivariate Adaptive Regression Splines
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