Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
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ACM Press
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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4. High performance compact power divider based on TSV;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. A Deep-Learning Approach for Wideband Design of 3D TSV-Based Inductors;IEEE Access;2022
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