Thermal and Power-Aware Run-time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays
Author:
Affiliation:
1. École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland
2. University of Applied Sciences Western Switzerland, Yverdon-les-bains, Switzerland
Funder
ERC Consolidator Grant COMPUSAPIEN
EC H2020 WiPLASH
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3526241.3530309
Reference28 articles.
1. F. Clermidy D Embedded Multi-Core : Some Perspectives. Design , Automation & Test in Europe (DATE) , 2011 . F. Clermidy et al. 3D Embedded Multi-Core: Some Perspectives. Design, Automation & Test in Europe (DATE), 2011.
2. Opportunities and Challenges for 3D Systems and Their Design
3. A study of IR-drop noise issues in 3D ICs with through-silicon-vias
4. A. Andreev PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Transactions on Computers (TC) , 201 8. A. Andreev et al. PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Transactions on Computers (TC), 2018.
5. A Design Framework for Thermal-Aware Power Delivery Network in 3D MPSoCs with Integrated Flow Cell Arrays
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1. 3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems;2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI);2023-06-20
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