Thermal and Power-Aware Run-time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

Author:

Najibi Halima1,Levisse Alexandre1,Ansaloni Giovanni1,Zapater Marina2,Atienza David1

Affiliation:

1. École Polytechnique Fédérale de Lausanne, Lausanne, Switzerland

2. University of Applied Sciences Western Switzerland, Yverdon-les-bains, Switzerland

Funder

ERC Consolidator Grant COMPUSAPIEN

EC H2020 WiPLASH

Publisher

ACM

Reference28 articles.

1. F. Clermidy D Embedded Multi-Core : Some Perspectives. Design , Automation & Test in Europe (DATE) , 2011 . F. Clermidy et al. 3D Embedded Multi-Core: Some Perspectives. Design, Automation & Test in Europe (DATE), 2011.

2. Opportunities and Challenges for 3D Systems and Their Design

3. A study of IR-drop noise issues in 3D ICs with through-silicon-vias

4. A. Andreev PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Transactions on Computers (TC) , 201 8. A. Andreev et al. PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Transactions on Computers (TC), 2018.

5. A Design Framework for Thermal-Aware Power Delivery Network in 3D MPSoCs with Integrated Flow Cell Arrays

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. 3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems;2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI);2023-06-20

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