Author:
Shin Jongchul,Kim Hyunjin,Kang Sungho
Cited by
3 articles.
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1. Delay Testable Design Using Modified Boundary Scan;Journal of The Japan Institute of Electronics Packaging;2021-11-01
2. Avoiding Temperature-Induced Errors in On-Chip Interconnects;Managing Temperature Effects in Nanoscale Adaptive Systems;2011-07-28
3. Testing SoC Interconnects for Signal Integrity;Nanometer Technology Designs High-Quality Delay Tests;2008