Congestion-aware layout design for high-throughput digital microfluidic biochips

Author:

Roy Sudip1,Mitra Debasis2,Bhattacharya Bhargab B.3,Chakrabarty Krishnendu4

Affiliation:

1. Indian Institute of Technology, Kharagpur, India

2. National Institute of Technology, Durgapur, India

3. Indian Statistical Institute, Kolkata, India

4. Duke University, Durham, NC

Abstract

Potential applications of digital microfluidic (DMF) biochips now include several areas of real-life applications like environmental monitoring, water and air pollutant detection, and food processing to name a few. In order to achieve sufficiently high throughput for these applications, several instances of the same bioassay may be required to be executed concurrently on different samples. As a straightforward implementation, several identical biochips can be integrated on a single substrate as a multichip to execute the assay for various samples concurrently. Controlling individual electrodes of such a chip by independent pins may not be acceptable since it increases the cost of fabrication. Thus, in order to keep the overall pin-count within an acceptable bound, all the respective electrodes of these individual pieces are connected internally underneath the chip so that they can be controlled with a single external control pin. In this article, we present an orientation strategy for layout of a multichip that reduces routing congestion and consequently facilitates wire routing for the electrode array. The electrode structure of the individual pieces of the multichip may be either direct-addressable or pin-constrained. The method also supports a hierarchical approach to wire routing that ensures scalability. In this scheme, the size of the biochip in terms of the total number of electrodes may be increased by a factor of four by increasing the number of routing layers by only one. In general, for a multichip with 4 n identical blocks, ( n + 1) layers are sufficient for wire routing.

Funder

Office of International Science and Engineering

Division of Computing and Communication Foundations

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

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