Development of microtransformers using MCM and electronic packaging technologies-Reference-Cited by-同舟云学术

Development of microtransformers using MCM and electronic packaging technologies

Published:2017 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 30th Symposium on Integrated Circuits and Systems Design Chip on the Sands - SBCCI '17
language:
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Author:

Rocha M. M.¹,Telles A. C. C.¹,Teixeira R. C.¹

Affiliation:

1. Renato Archer - CTI - Campinas, (SP), Brazil

Funder

FINEP

CNPq

Publisher

ACM Press

Reference10 articles.

1. E. Macrelli et al. 2015. Modeling, Design, and Fabrication of High-Inductance Bond Wire Microtransformers with Toroidal Ferrite Core. IEEE Trans. Power Electron. 30, 10 (2015), 5724--5737.

2. C. Ó Mathúna, N. Wang, S. Kulkarni, and S. Roy. 2012. Review of Integrated Magnetics for Power Supply on Chip (PwrSoC). IEEE Trans. Power Electron., 27, 11 (2012), 4799--4816.

3. A. C. C. Telles. 2016. Contribution to Modeling and Realization of Ultralow Voltage Oscillators with Application to Energy Harvesting. Ph. D. Thesis, University of Campinas, Campinas, Brazil (in Portuguese).

4. J. Lu, H. Jia, A. Arias, X. Gong and Z. J. Shen. On-chip bondwire transformers for power SOC applications. Proc. Appl. Power Electron. Conf., Feb. 2008, pp. 199--204

5. E. Macrelli et al. 2014. Design and Fabrication of a 29 μH Bondwire Microtransformer with LTCC Magnetic Core on Silicon for Energy Harvesting Applications. In Proc. Eurosensors Conf., 1--4.

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