A cross-layer design exploration of charge-recycled power-delivery in many-layer 3d-IC
Author:
Affiliation:
1. University of Virginia, Charlottesville, VA
2. McGill University, Montréal, QC, Canada
Funder
National Science Foundation
Defense Advanced Research Projects Agency
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2744769.2744774
Reference18 articles.
1. ARM. http://www.arm.com/products/processors/cortex-a/cortex-a9.php. ARM. http://www.arm.com/products/processors/cortex-a/cortex-a9.php.
2. The gem5 simulator
3. Electromigration—A brief survey and some recent results
4. A multi-story power delivery technique for 3D integrated circuits
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Voltage Stacking: A First-Order Modelization of an m × n Asynchronous Array for Chip and Architectural Design Exploration;Journal of Low Power Electronics and Applications;2024-08-27
2. PowerScout: Security-Oriented Power Delivery Network Modeling for Side-Channel Vulnerability Analysis;IEEE Transactions on Emerging Topics in Computing;2023
3. Design and development of a soft robotic manipulator;International Journal of Mechanics and Materials in Design;2019-07-29
4. Voltage-Stacked GPUs: A Control Theory Driven Cross-Layer Solution for Practical Voltage Stacking in GPUs;2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO);2018-10
5. Efficient and reliable power delivery in voltage-stacked manycore system with hybrid charge-recycling regulators;Proceedings of the 55th Annual Design Automation Conference;2018-06-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3