Current issues in packet switch design

Author:

Minkenberg Cyriel1,Luijten Ronald P.1,Abel François1,Denzel Wolfgang1,Gusat Mitchell1

Affiliation:

1. IBM Research, Rüschlikon, Switzerland

Abstract

Addressing the ever growing capacity demand for packet switches, current research focuses on scheduling algorithms or buffer bandwidth reductions. Although these topics remain relevant, our position is that the primary design focus for systems beyond 1 Tb/s must be shifted to aspects resulting from packaging disruptions. Based on trends such as increased link rates and improved CMOS technologies, we derive new design factors for such switch fabrics. For instance, we argue that the packet round-trip transmission time within the fabric has become a major design parameter. Furthermore, we observe that high-speed fabrics have become extremely dependent on serial I/O technology that is both high speed and high density. Finally, we conclude that in developing the architecture, packaging constraints must be put first and not as an afterthought, which also applies to solving the tremendous power consumption challenges.

Publisher

Association for Computing Machinery (ACM)

Subject

Computer Networks and Communications,Software

Reference12 articles.

1. Low-power system-level design of VLSI packet switching fabrics

2. http://www.telcordia.com "Network Equipment-Building System (NEBS) Requirements: Physical Protection " GR-63-CORE. http://www.telcordia.com "Network Equipment-Building System (NEBS) Requirements: Physical Protection " GR-63-CORE.

3. http://www.telcordia.com "Electromagnetic Compatibility & Electrical Safety " GR-1089-CORE. http://www.telcordia.com "Electromagnetic Compatibility & Electrical Safety " GR-1089-CORE.

4. H.B. Bakoglu "Circuits Interconnections and Packaging for VLSI " Addison-Wesley Pub. Co. Reading MA 1990. H.B. Bakoglu "Circuits Interconnections and Packaging for VLSI " Addison-Wesley Pub. Co. Reading MA 1990.

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