ThermoFit

Author:

Wang Guanyun1ORCID,Yang Yue1ORCID,Guo Mengyan1ORCID,Zhu Kuangqi1ORCID,Yan Zihan2ORCID,Cui Qiang3ORCID,Zhou Zihong1ORCID,Ji Junzhe1ORCID,Li Jiaji1ORCID,Luo Danli4ORCID,Pan Deying1ORCID,Fan Yitao1ORCID,Han Teng5ORCID,Tao Ye6ORCID,Sun Lingyun1ORCID

Affiliation:

1. Zhejiang University, China

2. MIT Media Lab, USA

3. Tsinghua University, China

4. University of Washington, USA

5. Institute of Software, Chinese Academy of Sciences, China

6. Hangzhou City University, China

Abstract

Smart orthoses hold great potential for intelligent rehabilitation monitoring and training. However, most of these electronic assistive devices are typically too difficult for daily use and challenging to modify to accommodate variations in body shape and medical needs. For existing clinicians, the customization pipeline of these smart devices imposes significant learning costs. This paper introduces ThermoFit, an end-to-end design and fabrication pipeline for thermoforming smart orthoses that adheres to the clinically accepted procedure. ThermoFit enables the shapes and electronics positions of smart orthoses to conform to bodies and allows rapid iteration by integrating low-cost Low-Temperature Thermoplastics (LTTPs) with custom metamaterial structures and electronic components. Specifically, three types of metamaterial structures are used in LTTPs to reduce the wrinkles caused by the thermoforming process and to permit component position adjustment and joint movement. A design tool prototype aids in generating metamaterial patterns and optimizing component placement and circuit routing. Three applications show that ThermoFit can be shaped on bodies to different wearables. Finally, a hands-on study with a clinician verifies the user-friendliness of thermoforming smart orthosis, and technical evaluations demonstrate fabrication efficiency and electronic continuity.

Funder

the Fundamental Research Funds for the Central Universities

Zhejiang Provincial Natural Science Foundation of China under Grant

the National Natural Science Foundation of China

Publisher

Association for Computing Machinery (ACM)

Subject

Computer Networks and Communications,Hardware and Architecture,Human-Computer Interaction

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