Confidence analysis for defect-level estimation of VLSI random testing

Author:

Jone Wen-Ben1,Tsai K. S.1

Affiliation:

1. National Chung-Cheng University

Abstract

The defect level in circuit testing is the percentage of circuits such as chips, that are defective and shipped for use after testing. Our previously published results showed that the defect level of circuit fabrication and testing should be a probability distribution, rather than a single value, and the concept of confidence degree was proposed [Gondalia et al. 1993; Jone et al. 1995]. In this work, defect level is represented by a confidence interval which is more conventional and easier to interpret. The point estimate of defect level analysis and conditions to avoid meaningless confidence intervals are also investigated. Methods for adaptive random test length determination driven by different confidence intervals or interval length are proposed to meet both test requirements and test costs tradeoff. Finally, a complete test plan that can direct the test flow from fabrication infancy to maturity is suggested.

Publisher

Association for Computing Machinery (ACM)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Reference31 articles.

1. ABRAMOVICI M. BREUER M. AND FRIEDMAN A. 1990. Digital Systems Testing and Testable Design. Computer Science Press New York.]] ABRAMOVICI M. BREUER M. AND FRIEDMAN A. 1990. Digital Systems Testing and Testable Design. Computer Science Press New York.]]

2. AGRAWAL V. D. AND SETH S.C. 1988. Test Generation for VLSI Chips. IEEE Computer Society Washington DC.]] AGRAWAL V. D. AND SETH S.C. 1988. Test Generation for VLSI Chips. IEEE Computer Society Washington DC.]]

3. Fault coverage requirements in production testing of LSI circuits;AGRAWAL V. D.;IEEE Trans. Solid-State Circ. SC-17,1982

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