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Dynamic fine-grained sparse memory accesses

Published:2018-10 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the International Symposium on Memory Systems
language:
Short-container-title:

Author:

Akin Berkin¹,Chou Chiachen²,Park Jongsoo³,Hughes Christopher J.¹,Agarwal Rajat⁴

Affiliation:

1. Intel Labs

2. Google and Intel

3. Facebook and Intel

4. Intel

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3240302.3240416

Reference61 articles.

1. 2013. HIGH BANDWIDTH MEMORY (HBM) DRAM. JEDEC JESD235. (2013). 2013. HIGH BANDWIDTH MEMORY (HBM) DRAM. JEDEC JESD235. (2013).

2. 2015. Hybrid Memory Cube Specification 2.1. www.hybridmemorycube.org. (2015). 2015. Hybrid Memory Cube Specification 2.1. www.hybridmemorycube.org. (2015).

3. 2015. Tezzaron Semiconductor DiRAM4 3D Memory. http://www.tezzaron.com/products/diram4-3d-memory/. (2015). 2015. Tezzaron Semiconductor DiRAM4 3D Memory. http://www.tezzaron.com/products/diram4-3d-memory/. (2015).

4. A scalable processing-in-memory accelerator for parallel graph processing

5. PIM-enabled instructions

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