Less is more! Support of Parallel and Time-critical Assembly Tasks with Augmented Reality
Author:
Affiliation:
1. OFFIS e. V. Oldenburg, Germany
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3473856.3473861
Reference64 articles.
1. DIN 2304-1:2020-04. 2020. Adhesive bonding technology - Quality requirements for adhesive bonding processes - Part 1: Adhesive bonding process chain. https://doi.org/10.31030/3138880 DIN 2304-1:2020-04. 2020. Adhesive bonding technology - Quality requirements for adhesive bonding processes - Part 1: Adhesive bonding process chain. https://doi.org/10.31030/3138880
2. A Survey of Augmented Reality
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4. Practice-Related Improvement in Working Memory is Modulated by Changes in Processing External Interference
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