A Spatial-Designed Computing-In-Memory Architecture Based on Monolithic 3D Integration for High-Performance Systems
Author:
Affiliation:
1. School of Integrated Circuits, Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China, China
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3611315.3633240
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1. Deep Residual Learning for Image Recognition
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4. Impact of On-chip Interconnect on In-memory Acceleration of Deep Neural Networks
5. Three-dimensional integration of nanotechnologies for computing and data storage on a single chip
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