Electrical conduction and spatially distributed charge in the epoxy resin package of semiconductor device.
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Published:1991
Issue:1
Volume:48
Page:33-39
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ISSN:0386-2186
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Container-title:KOBUNSHI RONBUNSHU
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language:ja
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Short-container-title:KOBUNSHI RONBUNSHU
Author:
HIGUCHI Hiroshi,MAEDA Muneo,YAMAUCHI Kenji,TAKAHASHI Nobuo
Publisher
Society of Polymer Science, Japan
Subject
Polymers and Plastics,General Environmental Science,Materials Science (miscellaneous),Chemical Engineering (miscellaneous)