Modification of Epoxy Resins by Resol Type Phenolic Resin.
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Published:1992
Issue:8
Volume:49
Page:671-676
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ISSN:0386-2186
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Container-title:KOBUNSHI RONBUNSHU
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language:ja
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Short-container-title:KOBUNSHI RONBUNSHU
Author:
ISHII Toshiaki,EGUCHI Shuji,OGATA Masatugu,KITAMURA Teruo,SUZUKI Hiroshi
Publisher
Society of Polymer Science, Japan
Subject
Polymers and Plastics,General Environmental Science,Materials Science (miscellaneous),Chemical Engineering (miscellaneous)
Cited by
1 articles.
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1. Study of curing mechanism of epoxy/phenolic system for underfill applications;Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)