Affiliation:
1. ADANA ALPARSLAN TURKES SCIENCE AND TECHNOLOGY UNIVERSITY
Abstract
Micro-electro-mechanical systems sensors are integrated systems used in many fields such as consumer electronics, the automobile industry, and biomedical, and their dimensions change between micrometers and millimeters. MEMS capacitive accelerometers are the most widely used sensor type among MEMS accelerometer sensors. As a result of the external force applied to the capacitive accelerometer sensor, the proof mass inside the sensor moves, and the capacitive change is measured as an electrical signal using reading circuits. In this review paper, general information about MEMS sensors is given, and a comprehensive review is made of MEMS capacitive accelerometers. In the study, the dynamic circuit of the MEMS capacitive accelerometer is given, and the calculation of the important values for the mechanical and electronic structure during the design of the capacitive MEMS accelerometer is explained. In addition, information about the readout circuits used to convert the capacitive change to voltage is given. Finally, the fabrication processes used to produce the final product are explained, and the studies on sample fabrication processes found in the literature are mentioned.
Publisher
Adana Alparslan Turkes Bilim ve Teknoloji Universitesi
Reference47 articles.
1. Fujita, H. (1997). A decade of MEMS and its future. In Proceedings of the Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, 1-7.
2. Mishra, M.K., Dubey, V., Mishra, P., Khan, I. (2019). MEMS technology: a review. Journal of Engineering Research Reports, 1-24, doi:10.9734/JERR/2019/v4i116891.
3. Hristov, M.H., Ruskov, S.I., Denishev, K.H., Uzunov, I.S., Grozdanov, V.E., Gaydazhiev, D.G. (2009). Design and simulation of horizontal accelerometers. Annual Journal of Electronıcs.
4. Vajargah, M.K., Shamsi, H. (2023). An accurate Verilog-A based model for MEMS capacitive accelerometer. AEU-International Journal of Electronics Communications, 164, 154625, doi:10.1016/j.aeue.2023.154625.
5. Liu, C.-H., Chang, H.-D., Li, K.-H., Lin, C.-H., Hsu, C.-J., Lin, T.-Y., Chou, H.-H., Huang, H.-C., Liao, H.Y.(2013). Adaptable and integrated packaging platform for MEMS-based combo sensors utilizing innovative wafer-level packaging technologies. In Proceedings of the 2013 IEEE 63rd Electronic Components and Technology Conference,1675-1681.