STUDY ON COOLING OF HIGH PERFORMANCE SIC FEATURES

Abstract

High-performance electronic parts are vital features in almost all modern motorized machines. These silicon components are significantly minimised, especially in transportation branch. Concentration of performance requires perfect cooling conditions. A fluid flow cooling by an active cooling circuit with heat sinks is a commonly used principle. Sufficient cooling and uniform temperature field on heat transfer area are crucial parameters for the sustainable function of Silicon-Carbide components. Producer of electric vehicles induces research in the field of coolers due to the requirements of installed SiC features. This study uses advanced CFD methods to analyse the current state of commonly manufactured heat exchangers and provides new approaches by CFD optimisation in combination with 3D printed replacement parts. Approach based on 3D print also allows design inspiration in natural principles. Biomimetic inspiration shows a wide range of thousands of years lasting optimisation made by nature. Research in this field can help us with the evolution of enhanced heat transfer surfaces. Developed coolers were examined by CFD techniques. Simulations of heat transfer are verified by laboratory measurement of prototype heatsinks. These techniques are presented on the unique design of a heat sink which was simulated, manufactured, and measured. The study shows CFD approaches, describes details of prototype measurement, and also deals with negative issues of metal 3D print.