SCANDALee: A Side-ChANnel-based DisAssembLer using Local Electromagnetic Emanations
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IEEE Conference Publications
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Revealing the Secrets of Radio Embedded Systems: Extraction of Raw Information via RF;IEEE Transactions on Information Forensics and Security;2024
2. A Sense of Self for Power Side-Channel Signatures: Time-Series Side-Channel Disassembler (TSD) and Integrity Monitor (TSD-IM);2023 IEEE Physical Assurance and Inspection of Electronics (PAINE);2023-10-24
3. PRIDES: A Power Rising Descending Signature for Improving IoT Security;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05
4. Side-channel disassembly on a System-on-Chip: A practical feasibility study;Microprocessors and Microsystems;2023-09
5. Instruction-Level Power Side-Channel Leakage Evaluation of Soft-Core CPUs on Shared FPGAs;Journal of Hardware and Systems Security;2023-09
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