Contribution of Metal Layer Thickness for Quantitative Backscattered Electron Imaging of Field Emission Scanning Electron Microscopy-Reference-Cited by-同舟云学术

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Contribution of Metal Layer Thickness for Quantitative Backscattered Electron Imaging of Field Emission Scanning Electron Microscopy

Published:2012 Issue:0 Volume:10 Page:301-304
ISSN:1348-0391
Container-title:e-Journal of Surface Science and Nanotechnology
language:en
Short-container-title:e-J. Surf. Sci. Nanotechnol.

Author:

Kim Hyonchol¹,Takei Hiroyuki¹²,Negishi Tsutomu³,Kudo Masato³,Terazono Hideyuki¹,Yasuda Kenji¹⁴

Affiliation:

1. Kanagawa Academy of Science and Technology, Japan

2. Department of Life Sciences, Faculty of Life Sciences, Toyo University, Japan

3. JEOL Ltd., Japan

4. Department of Biomedical Information, Division of Biosystems, Institute of Biomaterials and Bioengineering, Tokyo Medical and Dental University, Japan

Publisher

Surface Science Society Japan

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics,Bioengineering,Biotechnology

Link

https://www.jstage.jst.go.jp/article/ejssnt/10/0/10_301/_pdf

Reference14 articles.

1. [1] T. Sakurada, S. Hashimoto, Y. Tsuchiya, S. Tachibana, M. Suzuki, and K. Shimizu, J. Surf. Anal. 12, 118 (2005).

2. [2] G. Neubert and S. Rogaschewski, Phys. Status Solidi A 59, 35 (1980).

3. [3] H. Niedrig, J. Appl. Phys. 53, R15 (1982).

4. [4] A. Jablonski, C. Jansson and S. Tougaard, Phys. Rev. B 47, 7420 (1993).

5. [5] H. Kim, T. Negishi, M. Kudo, H. Takei, and K. Yasuda, J. Electr. Microsc. 59, 379 (2010).

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