Establishing the Relationship between Substrate Bias Voltage and Formation Process of Single Component Ion-Plasma's Film Based on Tin by Electric-Arc Evaporation-Reference-Cited by-同舟云学术

Establishing the Relationship between Substrate Bias Voltage and Formation Process of Single Component Ion-Plasma's Film Based on Tin by Electric-Arc Evaporation

Published:2011 Issue: Volume:9 Page:34-39
ISSN:1348-0391
Container-title:e-Journal of Surface Science and Nanotechnology
language:en
Short-container-title:e-J. Surf. Sci. Nanotechnol.

Author:

Kameneva Anna L.¹,Guselnikova L'ybov N.¹,Soshina Tatyana O.¹

Affiliation:

1. State Educational Institution of the Higher Vocational Education, Perm State Technical University, Russia

Publisher

Surface Science Society Japan

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics,Bioengineering,Biotechnology

Link

http://www.jstage.jst.go.jp/article/ejssnt/9/0/9_0_34/_pdf

Reference19 articles.

1. Effects of substrate bias and argon flux on the structure of titanium nitride films deposited by filtered cathodic arc plasma

2. [2] M. I. Samoilovich and A. L. Talis, Fund. Basis Eng. Sci. 2, 161 (2006).

3. [3] A. L. Roitburd, Uspekhi Phizicheskikh Nauk 113, 69 (1974).

4. Thermal stability of nitride thin films

5. The search for novel, superhard materials

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