Solid State Diffusion Bonding of Alumina with Aluminum Alloy

Author:

Chettah Maroua,Hamdi Ines,Boumerzoug Zakaria,Bedjaoui Walid,Delaunois Fabienne

Abstract

The objective of this work is to study the effect of time during the bonding process of alumina with an industrial aluminum 6060 alloy by the technique of solid-state welding at 600°C. Optical microscopy, scanning electron microscopy with energy dispersive spectroscopy, corrosion tests, and microhardness measurements were used as characterization techniques. The extended time during the bonding process had an effect on the microstructure of the interface and its mechanical properties. Oxygen diffusion was detected across the aluminum alloy/alumina interface. A recrystallization reaction developed on the aluminum side during the bonding process, which affected the aluminum alloy hardness values. By bonding metal to ceramic, it allows the use of ceramics in automotive engines to reduce weight, increase thrust-to-weight ratio and operating temperature, and improve working efficiency.

Publisher

Universiti Malaysia Pahang Publishing

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