Numerical Investigation of Interfacial Stress Distribution in Adhesive-Bonded Joints for Different Adhesive Materials-Reference-Cited by-同舟云学术

Numerical Investigation of Interfacial Stress Distribution in Adhesive-Bonded Joints for Different Adhesive Materials

Published:2022-12-10 Issue:2 Volume:14 Page:53-65
ISSN:1309-0267
Container-title:International Journal of Engineering and Applied Sciences
language:en
Short-container-title:IJEAS

Author:

SOMADDER Somnath¹,DAS Palash¹,ISLAM Md Ashraful¹,HASİB Md. Abdul¹

Affiliation:

1. KUET

Abstract

The widespread use of adhesive bonded connections has been used in a range of technical fields. In this paper, the interfacial stress distribution of adhesive bonded joint is presented. When determining whether or not a structure is dependable for use in operation, the stresses that act along the bond line of an adhesively bonded lap joint are of the utmost importance. The purpose of this study is to develop finite element solutions that are able to anticipate shear and peel stresses using the theory of elasticity as their foundation. The effect of adhesive properties on stress distribution is investigated by using different adhesive materials. By analysing five different adhesive materials it is concluded that ‘adhesive I’ is more reliable for operation.

Publisher

International Journal of Engineering and Applied Sciences

Subject

General Medicine

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