Effects of High-Intensity Light Curing Devices and Resin Adhesive System on Repair Strength of Amalgam with Resin Composite

Author:

AYAR Muhammet KerimORCID,DEMİRBAS Hafize GamzeORCID,YEŞİL ÖnderORCID

Abstract

This study aims to evaluate the effects of the new generation light curing devices and different adhesive systems on the shear repair strength between amalgam and resin composite. Ninety-six square-shaped amalgam (Cavex Non Gamma-2; Cavex Holland BV, Haarlem, the Netherlands) samples were prepared. The amalgam surfaces were polished with 600-grit abrasive paper. The prepared amalgam samples were divided into four groups (Single Bond Universal, 3M ESPE; Adper Easy One, 3M ESPE; Prebond SE, President Dental; OptiBond All-in-One, Kerr) according to the adhesive brand. Each adhesive group was divided into two subgroups according to the 3rd generation light curing devices (Elipar DeepCure-S [3M ESPE, USA], VALO Cordless [Ultradent, USA]) (n = 12). Microhybrid composite cylinders of 3 mm height and 2 mm diameter were placed on the amalgam surfaces by layered method with a silicone mold (Dynamic Plus; President Dental, Germany). Each layer was polymerized with a group specific light curing device. The samples were incubated in distilled water at 37 °C for 24 h before the shear-bond-strength test. The shear bond strength test was accomplished using a universal testing device. Statistical analyzes were made with two-way ANOVA and Tukey HSD tests. Two-way ANOVA revealed a significant effect of the adhesive system brand on bond strength (p < 0.00). Prebound SE provided the lowest bond strength between both light curing devices groups. There was no significant difference between the two light-curing devices groups among Single Bond Universal, Adper Easy One and OptiBond All-in-One resin adhesive systems. It has been revealed that the high-intensity LED light curing device brand does not have a significant effect on the amalgam-resin composite repair strength, and the repair strength may be more affected by the brand of the adhesive system used.

Publisher

Kaunas University of Technology (KTU)

Subject

General Materials Science

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