FastFlow: Accelerating Deep Learning Model Training with Smart Offloading of Input Data Pipeline

Author:

Um Taegeon1,Oh Byungsoo1,Seo Byeongchan1,Kweun Minhyeok1,Kim Goeun1,Lee Woo-Yeon1

Affiliation:

1. Samsung Research

Abstract

When training a deep learning (DL) model, input data are pre-processed on CPUs and transformed into tensors, which are then fed into GPUs for gradient computations of model training. Expensive GPUs must be fully utilized during training to accelerate the training speed. However, intensive CPU operations for input data preprocessing (input pipeline) often lead to CPU bottlenecks; correspondingly, various DL training jobs suffer from GPU under-utilization. We propose FastFlow, a DL training system that automatically mitigates the CPU bottleneck by offloading (scaling out) input pipelines to remote CPUs. FastFlow carefully decides various offloading decisions based on performance metrics specific to applications and allocated resources, while leveraging both local and remote CPUs to prevent the inefficient use of remote resources and minimize the training time. FastFlow's smart offloading policy and mechanisms are seamlessly integrated with TensorFlow for users to enjoy the smart offloading features without modifying the main logic. Our evaluations on our private DL cloud with diverse workloads on various resource environments show that FastFlow improves the training throughput by 1 ~ 4.34X compared to TensorFlow without offloading, by 1 ~ 4.52X compared to TensorFlow with manual CPU offloading (tf.data.service), and by 0.63 ~ 2.06X compared to GPU offloading (DALI).

Publisher

Association for Computing Machinery (ACM)

Subject

General Earth and Planetary Sciences,Water Science and Technology,Geography, Planning and Development

Reference57 articles.

1. Accessed in January 2023. Add more choices for data augmentation. https://github.com/NVIDIA/DALI/issues/1610. Accessed in January 2023. Add more choices for data augmentation. https://github.com/NVIDIA/DALI/issues/1610.

2. Accessed in January 2023. Amazon EC2 P3 Instances. https://aws.amazon.com/ec2/instance-types/p3/. Accessed in January 2023. Amazon EC2 P3 Instances. https://aws.amazon.com/ec2/instance-types/p3/.

3. Accessed in January 2023. Amazon S3. https://aws.amazon.com/s3. Accessed in January 2023. Amazon S3. https://aws.amazon.com/s3.

4. Accessed in January 2023. Automatic Speech Recognition using CTC. https://keras.io/examples/audio/ctc_asr/. Accessed in January 2023. Automatic Speech Recognition using CTC. https://keras.io/examples/audio/ctc_asr/.

5. Accessed in January 2023. Automatic Speech Recognition with Transformer. https://keras.io/examples/audio/transformer_asr/. Accessed in January 2023. Automatic Speech Recognition with Transformer. https://keras.io/examples/audio/transformer_asr/.

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