Thin-film multichip module packages for high-end IBM servers
Author:
Publisher
IBM
Subject
General Computer Science
Link
http://xplorestaging.ieee.org/ielx5/5288520/5389287/05389297.pdf?arnumber=5389297
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Three-dimensional silicon integration;IBM Journal of Research and Development;2008-11
2. 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias;IEEE Journal of Solid-State Circuits;2006-08
3. Wafer-Scale Microdevice Transfer/Interconnect: Its Application in an AFM-Based Data-Storage System;Journal of Microelectromechanical Systems;2004-12
4. Signal integrity and design consideration of an MCM for video graphic acceleration;IEEE Transactions on Advanced Packaging;2001
5. MCM-D/C packaging solution for IBM latest S/390 servers;IEEE Transactions on Advanced Packaging;2000
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