Mechanical packaging, power, and cooling design for the IBM z13-Reference-Cited by-同舟云学术

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Mechanical packaging, power, and cooling design for the IBM z13

Published:2015-07 Issue:4/5 Volume:59 Page:14:1-14:15
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Torok J. G.,Bosco F. E.,Goth G. F.,Loparco J. J.,Peets M.,Porter D.,Shevach S. G.,Tucker B. C.,VanDeventer A. C.,Wei X.,Wendling P. A.,Yu Y.-Y.,Zoodsma R. J.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx7/5288520/7175088/07175135.pdf?arnumber=7175135

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advances in IBM Z Water Cooling: z13, z14, z15;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01

2. IBM z15: Improved data center density and energy efficiency, new system packaging, and modeling;IBM Journal of Research and Development;2020-09

3. IBM z14: Improved datacenter characteristics, energy efficiency, and packaging innovation;IBM Journal of Research and Development;2018-03-01

4. Innovations in infrastructure firmware for the IBM z13;IBM Journal of Research and Development;2015-07

5. IBM z13: Energy efficiency, increased environmental range, and flexible data center characteristics;IBM Journal of Research and Development;2015-07

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